| 摘要 |
A polishing apparatus for uniformly polishing the whole of a target surface of a semiconductor wafer includes a wafer holder for holding a wafer by adsorption and a pad to which the wafer holder is compressed while rotating. Between a rotary shaft for the apparatus and the wafer holder is a mechanism for allowing the orientation of the wafer holder to change with an increased degree of freedom. This mechanism is formed with a container filled with a liquid and attached to the lower end of the rotary shaft and an elastic member which seals the liquid in the container.
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