发明名称 ELECTRONIC COMPONENT-PACKAGING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To reduce process loss by relatively and straightly sliding a solvent transfer part for forming a solvent film in electronic component and one of blades for forming film for forming the solvent film and then simultaneously bringing the solvent film into contact with a plurality of electronic component and then performing transfer simultaneously. SOLUTION: A slide-system flux transfer unit 100 is installed at the rear portion of an electronic component packaging device 1, a solvent transfer part and one of blades for forming film are slid relatively and straightly for forming a solvent film, and then a plurality of electronic component 33 that are retained by a component-retaining member are brought into contact with the solvent film simultaneously for transferring at the same time. Therefore, the plurality of electronic component 33 being sucked and retained by a plurality of nozzle 8 are lowered simultaneously for transferring flux, thus reducing time for moving up and down the nozzle as compared with a rotary-type transfer unit, reducing tact and also preventing the volatile constituent of flux from being volatilized for deteriorating packaging quality.
申请公布号 JP2000188498(A) 申请公布日期 2000.07.04
申请号 JP19990290971 申请日期 1999.10.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORI KAZUO;OKUDA OSAMU;UCHIYAMA HIROSHI;KABESHITA AKIRA
分类号 H05K13/04 主分类号 H05K13/04
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