| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for sealing electronic components by means of conducting secure sealing simply, at parts where sufficient thicknesses are required. SOLUTION: After a semiconductor package 12 is mounted on a substrate 11 and connected to the substrate 11 through leads 13, an auxiliary sealing plate 14 is placed on the package 12. The plate 14 is temporarily fixed to the upper surface of the package 12 with an adhesive having an electrical insulating property. Then the plate 14, package 12, and substrate 11 are coated with a sealing resin 15 by dipping or dispensing. Therefore, the leads 13 can be surely sealed with the resin 15, because the resin 15 gets in the space between the substrate 11 and plate 14 around the package 12 by surface tension.
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