HEATING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To reduce power consumption when the heat treatment to a body to be joined is not required by reducing the amount of gas supply heat when the heat treatment of an object to be heated is not required as compared with a case when the heat treatment is required by a device for controlling the amount of gas supply heat. SOLUTION: A circuit substrate 2 that is a body to be joined where parts 2a are placed on cream solder is carried from an inlet to an outlet by a transport part 3. The transport part 3 is contained and a heating gas is supplied via a heater 9c. A heating chamber 7a is provided for supplying a gas with a specific flow rate and temperature onto the body to be joined as a heat source and for heating and melting an object to be heated such as solder on the body to be joined. In the starting/preparing process of a reflow device, the temperature of heated air in each chamber is controlled by controlling the heater 9c via a temperature controller 20 with a controller 21 that is joined to a temperature-monitoring sensor 17c corresponding to the heat content of the circuit substrate 2. When the circuit substrate 2 is not subjected to reflow treatment, the temperature of each chamber is maintained at a lower temperature than a specific heat-treatment temperature.