发明名称 SUBSTRATE HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus which can easily control temperature accurately under a wide range of conditions. SOLUTION: A characteristic model, showing a measured relationship between an output command value of a heating lamp and the temperature of a substrate and a temperature change rate, is stored in advance. A heating command value YC each time during control is calculated by adding first and second heating command values YA and YB together. The first heating command value YA is an output command value, corresponding to a target value and is found, based on the characteristic model by a feed-forward compensator C1. The second heating command value YB is an output command value for following a physical quantity to the target value, using target and actually measured values of the physical quantity and is found by a feedback compensator C2. The second heating command value is modified, based on fuzzy-logic inferences. When two types of controls are combined, accurate temperature control can be attained under various conditions, thus eliminating the need for complicated adjustment.
申请公布号 JP2000188261(A) 申请公布日期 2000.07.04
申请号 JP19980364850 申请日期 1998.12.22
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NISHIHARA HIDEO;MASUDA MITSUHIRO
分类号 H01L21/26;(IPC1-7):H01L21/26 主分类号 H01L21/26
代理机构 代理人
主权项
地址