发明名称 Method and an apparatus for inspection of a printed circuit board assembly
摘要 A method and apparatus for inspecting a printed circuit board assembly especially with surface mount devices are provided. The method and apparatus include a multiple camera set-up utilizing both color and monochrome images. A very strong white light is employed as the light source. The multiple camera setup includes frontal and oblique looking cameras to examine the printed circuited board assembly from different angles. The strong white light source provides sufficient illumination evan at a small camera aperture hence increasing the depth of field. The method and apparatus are resistant against warpage of the PCB and variations in components' height.
申请公布号 US6084663(A) 申请公布日期 2000.07.04
申请号 US19970834945 申请日期 1997.04.07
申请人 HEWLETT-PACKARD COMPANY 发明人 SENG, TOH PENG
分类号 G01B11/24;G01B11/245;G01B11/30;G01N21/88;G01N21/956;G01R31/309;H05K3/00;(IPC1-7):G01N21/00;H04N7/18 主分类号 G01B11/24
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