发明名称 |
Method and an apparatus for inspection of a printed circuit board assembly |
摘要 |
A method and apparatus for inspecting a printed circuit board assembly especially with surface mount devices are provided. The method and apparatus include a multiple camera set-up utilizing both color and monochrome images. A very strong white light is employed as the light source. The multiple camera setup includes frontal and oblique looking cameras to examine the printed circuited board assembly from different angles. The strong white light source provides sufficient illumination evan at a small camera aperture hence increasing the depth of field. The method and apparatus are resistant against warpage of the PCB and variations in components' height.
|
申请公布号 |
US6084663(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19970834945 |
申请日期 |
1997.04.07 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
SENG, TOH PENG |
分类号 |
G01B11/24;G01B11/245;G01B11/30;G01N21/88;G01N21/956;G01R31/309;H05K3/00;(IPC1-7):G01N21/00;H04N7/18 |
主分类号 |
G01B11/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|