| 摘要 |
PROBLEM TO BE SOLVED: To maintain stable low-oxygen concentration without disturbing an inert atmosphere as a high-cooling speed that is adapted to lead-free solder by forming the circulation path of a refrigerant body with a cooling device that is provided in front of a melting solder bath as a panel. SOLUTION: Processing devices such as a preheater 2, a melted solder bath 3, and a cooling device 4 are successively installed as an automatic soldering device 1. A carrying device 5 drives above the processing devices to carry a printed-circuit board in a direction marked by an arrow A. A cooling device 4 is composed by a rectangular panel 11 with long holes, and a circulation path 12 of a refrigerant body is formed in a maze shape inside. An inflow port for allowing the refrigerant body to flow into the circulation path and an outflow port for allowing the refrigerant body to flow to the outside are formed at each end part of the circulation path 12. The refrigerant body escaping from the outflow port that is connected to a heat-exchange device with a pipe loses heat and the temperature is decreased. The refrigerant body whose temperature is reduced flows in the circulation path 12 from the inflow port of the cooling device 4 to cool the panel 11 and hence cooling the printed-circuit board passing near the panel with a low-temperature atmosphere can be conducted.
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