| 摘要 |
PROBLEM TO BE SOLVED: To provide softness by which a surplus clamping force can be absorbed and high heat conductivity to a best suited heat dissipation member by forming a skeleton part and a resin part of silicone cured products having varying heat conductivity, respectively. SOLUTION: A skeleton part 2 and a resin part 3 formed integrally of a part or the entirety of the skeleton part 2 are the constituents of the heat conductive silicone moldings, and the skeleton part 2 and the resin part 3 are formed of silicone cured products having varying heat conductivity respectively. A silicone raw material to be used is an addition reaction-type liquid silicone rubber, a silicone rubber of the heat vulcanizable miscible type and the like. For the heat dissipation member of electronic equipment, the addition reaction-type liquid silicone rubber is desirable because the adhesion between the heat generating face of a heat generating electronic part and a heat sink is demanded. In addition, the constitutional ratio of the skeleton part and the resin part is preferably 50-98% in terms of sectional area proportion. Further, it is decided in accordance with the use purpose which of the skeleton part or the resin part should have a higher heat conductivity. The difference in the heat conductivity between these parts is not particularly defined but is at least 2 W/m.k as one example. |
