发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board in which a hole for continuity having a superior electric connecting property can be formed, in which continuity property is given easily to the hole for continuity, and in which the thickness of a surface conductor layer and that of a rear-surface conductor layer can be controlled arbitrarily. SOLUTION: In this manufacturing method, a printed circing board which comprises a hole 1 for continuity used to electrically connect a surface conductor layer 2 to a rear-surface conductor layer 3 is manufactured. In this case, the manufacturing method is composed of a process wherein the hole 1 for continuity is formed in an insulating board 7, the surface conductor layer 2 comprises a land hole 21 in the peripheral edge part of the upper-part opening of the hole 1 for continuity is formed on the surface of the insulating board 7, and the rear-surface conductor layer 3 which comprises a covering part 31 used to cover the bottom part of the hole for continuity is formed on the rear surface of the insulating board 7. In addition, the manufacturing method is composed of a process wherein the rear-surface conductor layer 3 is electrified, the surface conductor layer 2 is not electrified, the insulating board is immersed in an electroplating tank, and a plating filling layer 10 used to connect the covering part 31 to the land hole 21 is formed at the inside of the hole 1 for continuity.
申请公布号 JP2000188471(A) 申请公布日期 2000.07.04
申请号 JP19980365262 申请日期 1998.12.22
申请人 IBIDEN CO LTD 发明人 TSUKADA KIYOTAKA;ISHIDA NAOTO
分类号 H05K3/40;(IPC1-7):H05K3/40 主分类号 H05K3/40
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