发明名称 Rotating system for electrochemical treatment of semiconductor wafers
摘要 An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the continuous moving cathode during electrochemical reaction.
申请公布号 US6083376(A) 申请公布日期 2000.07.04
申请号 US19990363258 申请日期 1999.07.28
申请人 MICRON TECHNOLOGY, INC. 发明人 AKRAM, SALMAN;HEMBREE, DAVID R.
分类号 C25D7/12;C25F7/00;H01L21/288;(IPC1-7):C25D5/00;C25B9/00;C25B11/00;C25D17/00 主分类号 C25D7/12
代理机构 代理人
主权项
地址