发明名称 |
Rotating system for electrochemical treatment of semiconductor wafers |
摘要 |
An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the continuous moving cathode during electrochemical reaction.
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申请公布号 |
US6083376(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19990363258 |
申请日期 |
1999.07.28 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM, SALMAN;HEMBREE, DAVID R. |
分类号 |
C25D7/12;C25F7/00;H01L21/288;(IPC1-7):C25D5/00;C25B9/00;C25B11/00;C25D17/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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