| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package, capable of reducing deformations such as warp produced when a flexible circuit board is applied to an opening part of a metal frame and maintaining that effect. SOLUTION: In a method for manufacturing a semiconductor package for carrying out mounting, wire-bonding, and resin sealing, etc., of a semiconductor element by the use of a structure, wherein a sheet-like flexible circuit board 7 is bonded to the opening part of a metal frame 1 with a bonding agent as an intermediate product for the semiconductor package, after the flexible circuit board 7 is bonded to the metal frame 1, warpage of the flexible circuit board 7 is reduced by reducing the water content within the flexible circuit board 7, and then the intermediate product obtained for the semiconductor package is vacuum-packed and sent to a next process.
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