发明名称 |
Method for fabricating a capacitor in a dynamic random access memory |
摘要 |
The invention is a method for fabricating a capacitor in a dynamic random access memory. The capacitor has double cylinder structure and is fabricated by utilizing an insulating side wall spacer to pre-define the capacitor structure. Then, a wet etching process is applied to remove the insulating side wall spacer and expose a surface of a structured lower electrode. Then, a dielectric thin film and an upper electrode are formed over the surface of the lower electrode sequentially to form the capacitor.
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申请公布号 |
US6083804(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19980103957 |
申请日期 |
1998.06.24 |
申请人 |
UNITED SEMICONDUCTOR CORP. |
发明人 |
CHUANG, SHU-YA |
分类号 |
H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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