发明名称 Method for fabricating a capacitor in a dynamic random access memory
摘要 The invention is a method for fabricating a capacitor in a dynamic random access memory. The capacitor has double cylinder structure and is fabricated by utilizing an insulating side wall spacer to pre-define the capacitor structure. Then, a wet etching process is applied to remove the insulating side wall spacer and expose a surface of a structured lower electrode. Then, a dielectric thin film and an upper electrode are formed over the surface of the lower electrode sequentially to form the capacitor.
申请公布号 US6083804(A) 申请公布日期 2000.07.04
申请号 US19980103957 申请日期 1998.06.24
申请人 UNITED SEMICONDUCTOR CORP. 发明人 CHUANG, SHU-YA
分类号 H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L21/20 主分类号 H01L21/02
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