| 摘要 |
PROBLEM TO BE SOLVED: To accurately measure by stably obtaining a connection state with a lead of a measured semiconductor device on a holder, eliminating occurrence of lead scraps and a measurement error by the lead scraps. SOLUTION: The measurement device is provided with a holder 2 providing a contact plate 3 catching a lead 7 with a contact 4 corresponding to the lead 7, a contact plate 10 for pressing the lead 7 of a measured semiconductor device 6 to a side face opposed to the holder 2 with the contact 11, and one or plurality of movable carriages 8 movably provided in an approaching and separating direction to the holder 2. Insulation projections 5 partitioning between every adjacent contact 4, 4 is provided on the plate 3 of the holder 2.
|
