| 摘要 |
PROBLEM TO BE SOLVED: To provide adhesives capable of obtaining a high reliability semiconductor package free of package cracks when the semiconductor package is mounted on a substrate through a reflow oven in the semiconductor package using a copper lead frame, and semiconductor devices using the same. SOLUTION: Adhesives comprise (a) a cyanate compound and (b) a difunctional to pentafunctional epoxy compound. The adhesives preferably contain 0.02-1.50 equivalents of component (b) as epoxy group per equivalent of component (a), and the cyanate compound of component (a) is preferably at least one compound selected from 1,3-bis[4-cyanatophenyl-1-(1- methylethylidene)]benzene, 1,1-bis(4-cyanatophenyl)ethane and a cyanated novolak.
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