| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which the filling and formation of a via hole by an electroplating operation and the formation of a conductor circuit can be achieved simultaneously without using a high-cost apparatus. SOLUTION: An interlayer insulating layer 2 is formed on a lower-layer conductor circuit formation substrate 1. An opening is formed in the interlayer insulating layer 2. The surface of the interlayer insulating layer 2 and the inner wall of the opening are made conductive. After that, the opening is filled by an electroplating operation so as to form a via hole. A multilayer printed wiring board in which an upper-layer conductor circuit is formed is manufactured. The electroplating operation is performed in such a way that an aqueous solution in which 0.1 to 1.5 mmol/l of at least one kind of an additive selected from thiourea, cyanide and alkylene oxide and metal ions are contained as a plating liquid. |
