发明名称 Buried shallow trench isolation and method for forming the same
摘要 An integrated semiconductor device includes a substrate having a buried shallow trench isolation structure and an epitaxial layer disposed over the substrate and the buried shallow trench isolation structure. The epitaxial layer includes a shallow trench isolation structure that extends over the buried shallow trench isolation structure in the substrate to substantially reduce leakage current in the substrate to prevent device latch-up.
申请公布号 US6083797(A) 申请公布日期 2000.07.04
申请号 US19990324858 申请日期 1999.06.03
申请人 WINBOND ELECTRONICS CORPORATION 发明人 WONG, SHYH-CHYI;LIN, SHI-TRON
分类号 H01L21/336;H01L21/762;H01L21/8238;(IPC1-7):H01L21/336 主分类号 H01L21/336
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