发明名称 Method for fabricating high voltage semiconductor device
摘要 The present invention discloses a high voltage semiconductor device with high breakdown voltage without increment in area occupied an increase in the size of junction region. Each junction region includes: (i) a first impurity region of a first conductivity type of a low impurity concentration formed at a predetermined position in the semiconductor substrate, (ii) a second impurity region of a second conductivity type of a medium impurity concentration formed in the first impurity region, a part of the second impurity region being exposed to the surface of the substrate, and (iii) a third impurity region of a first conductivity type of a high impurity concentration, the third impurity region being in contact with the second impurity region, wherein a reverse bias is applied to the third impurity region.
申请公布号 US6083800(A) 申请公布日期 2000.07.04
申请号 US19990283507 申请日期 1999.04.01
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 PARK, SANG-JUN
分类号 H01L21/335;H01L21/336;H01L29/08;H01L29/78;(IPC1-7):H01L21/00;H01L21/20;H01L21/823 主分类号 H01L21/335
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