PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION OF RELIEF PATTERN AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition which suppresses peeling of a pattern from a substrate after development of a photoresist in a process for producing electronic parts such as a semiconductor element, is excellent also in shelf life stability in the solution state and has good heat resistance and adhesiveness to a base material after heating at a high temperature. SOLUTION: The photosensitive resin composition contains a polymer having coating forming ability and an organosilane compound having a group of the formula [where each of R1 and R2 is a hydrocarbon group and (m) is an integer of 0-3].