| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor cleaning device that can improve the semiconductor wafer cleaning efficiency of a chemical agent, that is, pure water substituting efficiency, etc. SOLUTION: After a semiconductor wafer 6 positioned in a cleaning bath is treated with a chemical agent, pure water is supplied to the semiconductor wafer 6 from the lower part to clean the semiconductor wafer 6. This cleaning device is provided with a dispersing board 3 disposed in the lower part of the cleaning bath for dispersing the pure water and a liquid suction means 40 disposed in the upper part of the cleaning bath for sucking liquid containing at least either of the pure water and the chemical agent in the cleaning bath.
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