| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a structure of a package for semiconductor device and its manufacturing method. SOLUTION: A copper base substrate adhered to a polyimide 2 as an insulator is formed on a comb-shaped lead pattern 3 and a ground pattern 4 insulating the lead pattern by resist patterning. A desired wiring pattern 12 is formed on a copper foil which is formed on the other face of the polyimide, and an island 15 for mounting a semiconductor chip 13 thereto as well as a through-hole 11 to obtain electrical conduction between a copper wiring pattern and a copper base substrate is formed on the poyimide, and the through-hole 11 is embedded by metallic plating. Then the substrate is packaged with a mold resin 1, resulting in a packaging structure.</p> |
