| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a structure and method for mounting semiconductor device by which the occurrence of cracks at the junctions of bump electrodes can be prevented and a semiconductor device can be mounted highly efficiently. SOLUTION: A solder ball section (bump electrode section) 18 is formed in the periphery of a PBGA package (semiconductor device), by arranging solder balls (bump electrodes) 16 in the periphery of a package 12, and the package 12 is electrically connected to a printed wiring board (mounting substrate) 14 through the solder balls 16. Only in the solder ball section 18, a packed resin layer 20 is formed. The spot where the solder balls 16 are not arranged on the inside of the solder ball section 18 is not filled with the resin, but a space section 22 is formed.</p> |
