发明名称 FLAME-RETARDED RESIN COMPOSITION AND SEMICONDUCTOR- SEALING MATERIAL AND LAMINATED BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flame-retarded resin composition that has a high degree of flame retardancy and excellent reliability with no addition of halogen compound. SOLUTION: This resin composition comprises (A) an epoxy resin that has at least two epoxy groups in one molecular, (B) a curing agent, and (C) an organophosphorus compound that has a chemical structure that at least one phosphorus atom covalently bonds to at least one carbon atom in one molecule and bears at least two hydroxy groups in one molecule. In this resin composition, the content of phosphorus in the resin composition is 0.3-5 wt.%.
申请公布号 JP2000186186(A) 申请公布日期 2000.07.04
申请号 JP19980364988 申请日期 1998.12.22
申请人 SUMITOMO BAKELITE CO LTD 发明人 ITO MIKIO;HIROSE HIROSHI
分类号 B32B27/18;B32B27/38;C08G59/62;C08K5/5397;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;C08K5/539 主分类号 B32B27/18
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