Process for producing a sensor arrangement for measuring temperature

摘要

A process is provided for producing a sensor arrangement for measuring temperature with a temperature-sensitive measuring resistance element which has a thin, metallic resistance layer electrically-insulated toward the outside on a ceramic substrate and free-lying contact surfaces, which are connected electrically-conducting and directly mechanically fast with high-temperature-resistant conductor strips, electrically insulated from one another, on a ceramic board. The measuring resistance element is bonded and fastened on one end of the board by laying it on a still moist thick-film conducting paste printed on immediately before outfitting on the board and subsequently burning it in. On the end of the board away from the measuring resistance element, contact surfaces for connection of a plug or cable are arranged. The temperature sensor, a standard component in the form of a flat measuring resistance element, is applied wirelessly as an SMD component on the ceramic board. The sensor arrangement manufactured with the process is suited for temperature measurements above 400 DEG C. as well. The process is economical in using only a few standardized components and easily automatable process steps.