发明名称 Printed circuit board with high electronic component density
摘要 PCT No. PCT/JP97/00179 Sec. 371 Date Oct. 2, 1997 Sec. 102(e) Date Oct. 2, 1997 PCT Filed Jan. 28, 1997 PCT Pub. No. WO97/29621 PCT Pub. Date Aug. 14, 1997A printed-circuit board (10) is provided with a main printed-wiring board (12) having a first conductor pattern (16), and first electronic components (18) mounted on the main printed-wiring board and electrically connected to the first conductor pattern. Component units (22) are mounted on the main printed-wiring board. Each of the component units includes an auxiliary printed-wiring board (24) having a second conductor pattern (28), and a second electronic component (32) mounted on the auxiliary printed-wiring board and electrically connected to the second conductor pattern. Each component unit is mounted on the main printed-wiring board, covering one first electronic component (18). Each second conductor pattern is electrically connected to the first conductor pattern.
申请公布号 US6084780(A) 申请公布日期 2000.07.04
申请号 US19970945539 申请日期 1997.10.02
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HAPPOYA, AKIHIKO
分类号 H05K1/18;H05K1/00;H05K1/02;H05K1/14;H05K3/34;H05K3/36;(IPC1-7):H05K7/06 主分类号 H05K1/18
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