| 摘要 |
PROBLEM TO BE SOLVED: To realize improvement in heat releasing property and high frequency characteristic of a semiconductor package, reduction in switching noise thereof, and miniaturization of the package. SOLUTION: Insulating layers 32 and 33 are formed on both upper and lower surfaces of a ground core 31 which keeps ground potential, respectively, and a semiconductor chip 35 is joined onto an exposed surface of the ground core 31 in a cavity 34 formed in the upper insulation layer 32. Thereby the heat generated from the semiconductor chip 35 is transmitted directly from the entire lower surface of the semiconductor chip 35 to the ground core 31, and then released efficiently from a plurality of radiating vias 48. Furthermore, the ground terminal of the semiconductor chip 35 is bonded to the exposed surface of the ground core 31 with a bonding wire 40. Thereby, since the length of wiring from the semiconductor chip 35 to the ground core 31 becomes shortest, the inductance of ground wiring is made smaller, and high frequency characteristic is improved, requirements for speed increase is met, and switching noise is also reduced. |
