| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture circuit board for electronic-component mounting whose reliability and productivity are high. SOLUTION: A plurality of circuit conductors 2 which are composed of a metal are applied to the surface of a board 1. After that, prescribed regions of the circuit conductors 2 are irradiated with a laser beam. A part of the circuit conductors 2 is heated and melted. In addition, the molten metal is moved onto the circuit conductors 2 around the regions irradiated with the laser beam. Bump electrodes 3 which are composed of a metal of the same quality as the circuit conductors 2 are formed. As a result, a circuit board for electronic- component mounting is manufactured.</p> |
