发明名称 PRODUCTION OF MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent adhesion of a green chip by spraying fine powder onto the surface of an alternate laminate block of ceramic sheet and inner electrode and then cutting the laminate block into a specified green chip using a cutter. SOLUTION: A green sheet formed with an inner electrode 2 is laminated on the surface of an ineffective layer 3 and pressed before a carrier film stripped off. A green sheet formed with an inner electrode 2 is laminated on the surface of the green sheet while being shifted by a specified dimension in the longitudinal direction of the inner electrode 2 and then pressed to strip off the carrier film. After repeating lamination while shifting the green sheet every other layer, the ineffective layer 3 is laminated and pressed to produce a laminate block. Subsequently, wheat flour 5 is sprayed onto the upper surface of the laminate block 4 which is then cut into a green chip shape by applying a cutter 6. According to the method, readhesion of the green chips is prevented and the green chips can be separated easily.
申请公布号 JP2000188229(A) 申请公布日期 2000.07.04
申请号 JP19980362636 申请日期 1998.12.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAZAKI MITSUHIRO
分类号 H01G4/12;(IPC1-7):H01G4/12 主分类号 H01G4/12
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