Photopolymerizable, coatable organosol and method

摘要

Photopolymerizable plastisol and organosol photoresist and solder mask coating compositions are described herein. These compositions include an ethylenically unsaturated photopolymerizable liquid plasticizer; a particulate, thermoplastic resin is dispersed in the plasticizer, the said resin having a midpoint Tg greater than 110 DEG C. and an acid number greater than 110; a tertiary amine stabilizer; and a photoinitiator. The organosol includes a diluent along with the other ingredients.