发明名称 |
Spindle assembly for force controlled polishing |
摘要 |
A spindle assembly for force controlled operation in applications such as the chemical mechanical planarization of semiconductor wafers includes an axially and rotatably movable spindle driven by a force producing device. The force producing device is controlled by a position feedback loop in a first mode of operation and a spindle force control feedback loop in a second mode of operation so that the same force producing device controls spindle movement in the first mode of operation and maintains a constant pressure on a workpiece based on the detected applied pressure in the second mode of operation.
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申请公布号 |
US6083082(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19990385769 |
申请日期 |
1999.08.30 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
SALDANA, MIGUEL A. |
分类号 |
B24B41/047;B24B37/00;B24B37/04;B24B41/04;B24B49/10;B24B49/16;G05B19/39;(IPC1-7):B24B49/00 |
主分类号 |
B24B41/047 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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