| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting board which restrains the progress of the hardening reaction of an adjacent anisotropic conductive bonding film(ACF) when an electronic component is mounted facedown, e.g. when the electronic component is mounted on a board composed of a material of good thermal conductivity such as a metal circuit board. SOLUTION: An anisotropic conductive bonding film is interposed between a continuity part and a protruding terminal 11, so that the continuity part of an interconnection or a terminal on the side of a board, and the protruding terminal 11 which is formed so as to protrude from the component mounting face of an electronic circuit component faced with the continuity part, are set to electric continuity and mechanical fixation. An anisotropic conductive bonding film piece 2 is pasted so as to cover the protruding terminal 11. Then, the continuity part and the protruding terminal 11 are positioned, and the continuity part and the protruding terminal 11 are set to electric continuity and mechanical fixation by a thermocompression bonding operation.
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