发明名称 Intergrated processor substrate protective enclosure for use in desktop PC systems
摘要 An electronic cartridge which includes a cover. The cover is coupled to a substrate which has an integrated circuit package. A portion of the cover extends over and is spaced from a plurality of conductive pads located along an edge of the substrate. The conductive pads can be inserted into a card edge electrical connector that is mounted to a motherboard. The cover of the present invention protects the conductive pads while allowing the substrate to be plugged into a card edge connector.
申请公布号 US6084773(A) 申请公布日期 2000.07.04
申请号 US19980024921 申请日期 1998.02.17
申请人 INTEL CORPORATION 发明人 NELSON, DARYL;STARK, MICHAEL;RUTIGLIANO, MICHAEL;LIESKA, BILL
分类号 H05K5/02;(IPC1-7):H05K7/20 主分类号 H05K5/02
代理机构 代理人
主权项
地址