发明名称 |
Heat dissipation system having releasable attachment assembly |
摘要 |
A heat dissipation system for a heat generating electronic device includes a releasable attachment assembly for removably securing a heat sink to a heat spreader plate thereof includes at least one spring clip for biasing the heat spreader plate into a secured engagement with the heat sink. The spring clips are adapted to allow easy engagement and/or disengagement of the heat sink from the heat spreader plate, thereby facilitating the use of variously configured heat sinks as part of the heat dissipation system.
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申请公布号 |
US6082440(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19980019546 |
申请日期 |
1998.02.06 |
申请人 |
THERMALLOY, INCORPORATED |
发明人 |
CLEMENS, DONALD L.;HEATLY, MICHAEL M.;SMITHERS, MATTHEW C.;MELLINGER, MARK C. |
分类号 |
H01L23/40;(IPC1-7):F28F7/00 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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