| 摘要 |
The semiconductor package 1 is connected to a printed wiring board 2 by solder balls 3, and resin fillets 4 formed adjacent each solder ball prevent stress in the assembly. The package 1 is provided with pads 5 and solder resist 6 whilst the printed wiring board has electrodes 7 and solder resist 8. Cream solder is applied to the electrodes before the package is positioned on the printed wiring board. When the solder is melted, resin in the solder flows to form the resin fillets. The solder balls may be melted in order to remove the package for repair. |
