发明名称 Polyimide resin composition
摘要 <p>A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide Äpolyimide (1)Ü having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide Äpolyimide (2)Ü having a repeating unit represented by the chemical formula 2. According to the present invention, there are provided a polymer alloy in which the advantages of the polyimide (1) and the polyimide (2) are utilized and the disadvantages of the polyimide (1) and the polyimide (2) are reduced; a polyimide resin composition from which crystalline molded articles can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds; and a polyimide resin composition from which molded articles having an excellent dimensional accuracy and flexural modulus can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds, for example, in the case that the molded articles are intended to be used at a high temperature of 230 DEG C or more, for example, a temperature of 230 to 300 DEG C, or 230 to 250 DEG C.</p>
申请公布号 EP1013714(A1) 申请公布日期 2000.06.28
申请号 EP19980124559 申请日期 1998.12.22
申请人 MITSUI CHEMICALS, INC. 发明人 KIDO, HIROYASU;YOSHIMURA, MASAJI;YOSHIDA, YASUNORI;YANAGIHARA, KAYAKO;OIKAWA, HIDEAKI;TAMAI, SHOJI;KOBA, TOMOHITO
分类号 C08L79/08;(IPC1-7):C08L79/08 主分类号 C08L79/08
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