| 摘要 |
<p>A printed circuit device comprising, a printed circuit board (10) having an electrically conductive heat plane (14) associated with a surface thereof, the circuit board (10) having an opening (12) formed therein which exposes a ground layer or track (11) of the circuit board, a wall defining said opening (12) being provided with an electrically conductive coating (13) which is electrically connected to the ground layer or track (11), the heat plane (14) being provided with a cut-out (15) defining a projection (16) which is bent to extend into the opening (12), the projection (16) being secured to said coating (13) electrically to connect the coating (13) and the ground layer or track (11) to the heat plane (14). The invention also resides in a method of manufacturing a printed circuit device and in a heat plane for use in such a device. <IMAGE></p> |
