| 摘要 |
A method of mending and testing a semiconductor apparatus. Only one L-shaped laser target or one set of targets forming a T-shaped target is in use. By choosing a primary laser target on the device with a damaged circuit, and a reference laser target on a device peripheral to the device with the damaged circuit, the laser mending machine is fed with the data of the coordinates of the primary and reference targets. The positions of these targets are scanned and calculated by the laser mending machine. With the feeding of the relative coordinates of these targets into the laser mending machine, the position to be mended, that is, the position with a damaged circuit, is obtained correctly. The fuse in the damaged circuit is then blown, and the circuit replaced by a new circuit with the same function.
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