发明名称 |
Semiconductor package consisting of multiple conductive layers |
摘要 |
An electronic component includes a substrate (301, 801), a leadframe (101, 601, 710) coupled to a first surface of the substrate (301, 801) and extending beyond the first surface and towards a second surface of the substrate (301, 801), and an electrically conductive layer coupled to the second surface and coplanar with a contact portion of the leadframe (101, 601, 710) where the leadframe (101, 601, 710) and the electrically conductive layer form a package around the substrate (301, 801). |
申请公布号 |
US6081031(A) |
申请公布日期 |
2000.06.27 |
申请号 |
US19980106472 |
申请日期 |
1998.06.29 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
LETTERMAN, JR., JAMES P.;LANINGA, ALBERT J.;KNAPP, JAMES H.;FAUTY, JOSEPH K.;BURGHOUT, WILLIAM F. |
分类号 |
H01L23/495;H05K3/34;(IPC1-7):H01C23/12;H01C23/495;H01C23/52 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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