发明名称 Wafer heating apparatus
摘要 In order to achieve concentric distribution of temperatures over a wafer supporting surface and improve the uniformity of heating, a heating resistor 4 having a configuration for providing a predetermined heater pattern buried in a ceramic substrate 2 constituting a wafer heating apparatus is made from arc portions 4a-4g which have different radii and are arranged to form concentric circles disposed at substantially the same intervals and straight portions 4h-4m which connect those of the arc portions 4a-4g that are adjacent to each other in the radial direction thereby to form a series circuit, while the arc portions 4a-4g and the straight portions 4h-4m are made in substantially the same strip width and the distance L1 between a pair of straight portions among the straight portions 4h-4m which are located on the same circle is made less than the distance L2 between the arc portions which are adjacent to each other in the radial direction.
申请公布号 US6080970(A) 申请公布日期 2000.06.27
申请号 US19980218996 申请日期 1998.12.22
申请人 KYOCERA CORPORATION 发明人 YOSHIDA, MASAO;IMAIZUMI, SUEHIRO
分类号 H05B3/18;C23C14/54;C23C16/46;H01L21/00;H01L21/02;H01L21/205;H01L21/302;H01L21/3065;H01L21/31;H01L21/324;H05B3/14;H05B3/28;(IPC1-7):H05B3/68 主分类号 H05B3/18
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