发明名称 |
Wafer heating apparatus |
摘要 |
In order to achieve concentric distribution of temperatures over a wafer supporting surface and improve the uniformity of heating, a heating resistor 4 having a configuration for providing a predetermined heater pattern buried in a ceramic substrate 2 constituting a wafer heating apparatus is made from arc portions 4a-4g which have different radii and are arranged to form concentric circles disposed at substantially the same intervals and straight portions 4h-4m which connect those of the arc portions 4a-4g that are adjacent to each other in the radial direction thereby to form a series circuit, while the arc portions 4a-4g and the straight portions 4h-4m are made in substantially the same strip width and the distance L1 between a pair of straight portions among the straight portions 4h-4m which are located on the same circle is made less than the distance L2 between the arc portions which are adjacent to each other in the radial direction.
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申请公布号 |
US6080970(A) |
申请公布日期 |
2000.06.27 |
申请号 |
US19980218996 |
申请日期 |
1998.12.22 |
申请人 |
KYOCERA CORPORATION |
发明人 |
YOSHIDA, MASAO;IMAIZUMI, SUEHIRO |
分类号 |
H05B3/18;C23C14/54;C23C16/46;H01L21/00;H01L21/02;H01L21/205;H01L21/302;H01L21/3065;H01L21/31;H01L21/324;H05B3/14;H05B3/28;(IPC1-7):H05B3/68 |
主分类号 |
H05B3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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