| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulation paste reduced in the bleed out of the resin component and having excellent adhesiveness by mixing an epoxy resin having a specified molecular weight with a curing agent, an organic solvent, a coupling agent, and an inorganic filler in a specified ratio. SOLUTION: This paste comprises 100 pts.wt. epoxy resin represented by formula I and having a number-average molecular weight of 600-1,000, 50-100 pts.wt. curing agent, 50-150 pts.wt. organic solvent, 5-10 pts.wt. coupling agent, and 50-150 pts.wt. inorganic filler. In the formula, R1, R3, and R5 are each a 1-3C monovalent aliphatic group; R2 and R4 are each a 1-3C divalent aliphatic group; n is 1-5; and OG is formula II. The curing agent used is desirably dicyandiamide, imidazole, or a phenol novolak resin. The organic solvent used is desirably one having a boiling point of 130-170 deg.C. The coupling agent used is desirably a mercapto-functional silane coupling agent. The inorganic filler used is exemplified by calcium carbonate, silica, or alumina and is desirably one having a mean particle diameter of 0.5-10μm.
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