Sequential build-up organic chip carrier and method of manufacture

摘要

A method for manufacturing electronic circuit assemblies. A layer of dielectric material is attached to a layer of electrically conductive material. Vias are formed in the layer of dielectric material and filled with conductive paste material. The resulting assembly is attached to a substrate. Because the vias are formed and filled before the dielectric layer is attached to the substrate, it is not necessary to scrap the entire multi-layer structure, which includes the substrate and all the attached layers, when a problem occurs during via formation or filling. This increases the overall yield for the entire circuit assembly manufacturing process.