发明名称 Plasma processing apparatus
摘要 An inductively coupled type dry etching apparatus has an RF antenna disposed on the ceiling wall of a process chamber. A susceptor is arranged in the process chamber, for mounting a semiconductor wafer thereon. The ceiling wall has a matrix of alumina ceramic, and heat generating elements of a salt of a transition metal oxide, which are dispersed in the matrix and capable of self-generating heat by an RF electric field.
申请公布号 US6079357(A) 申请公布日期 2000.06.27
申请号 US19980173177 申请日期 1998.10.15
申请人 TOKYO ELECTRON YAMANASHI LIMITED;JAPAN SCIENCE AND TECHNOLOGY CORPORATION 发明人 HAMA, KIICHI
分类号 H05H1/46;C23C16/50;C23F4/00;H01J37/32;H01L21/205;H01L21/302;(IPC1-7):C23C16/00;H05H1/00 主分类号 H05H1/46
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