Conductive paste and method for producing ceramic substrate using the same

摘要

A conductive paste for forming via-holes in a ceramic substrate, which paste contains about 80-94 wt. % spherical or granular conductive metal powder having a particle size of about 0.1-50 mu m, 1-10 wt. % resin powder which swells in a solvent contained in the conductive paste and has a particle size of about 0.1-40 mu m, and about 5-19 wt. % an organic vehicle. The paste hardly generates cracks during firing to thereby attain excellent reliability in electric conduction and which can provide a via-hole or through hole having excellent solderability and platability. A method for producing a ceramic substrate making use of the paste is also disclosed.