发明名称 POTTING AGENT FOR SEPARATION MEMBRANE MODULE HOLLOW FIBER MEMBRANE MODULE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a potting agent capable of increasing the cure rate of the thermosetting adhesive-based potting agent without deteriorating heat resis tance and chemical resistance and capable of increasing the crosslinking density of cured matter and improving the chemical resistance so that the hardness of the cured matter is not increased at the time of making a separation membrane module. SOLUTION: In the potting agent for fixing in a water-tight and air-tight the separation membrane to a structure, the potting agent for the separation membrane module containing at least sorbitol polyglycidylether in the potting agent, the potting agent containing amine based curing agent in the potting agent, and moreover, the potting agent containing bisphenol type epoxy resin, urethan modified epoxy resin are used.
申请公布号 JP2000176253(A) 申请公布日期 2000.06.27
申请号 JP19980375496 申请日期 1998.12.16
申请人 MITSUBISHI RAYON CO LTD 发明人 WATARI KENJI;TAKEDA SATORU
分类号 B01D63/00;B01D63/02;C09J163/00;(IPC1-7):B01D63/00 主分类号 B01D63/00
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