| 摘要 |
PROBLEM TO BE SOLVED: To reduce the deposition of solid materials and also reduce the frequency of cleaning of a cup by forming a coupling mechanism for flowing a rinsing liquid all over the whole periphery of the cup on the upper side of a position, whereon an excessive chemical liquid separated from a wafer of the cup hits. SOLUTION: Jet outlets 7 from which a rinsing liquid is jetted out toward the inner face of a cup 5 are so formed as to flow the rinsing liquid all over the whole periphery of the cup 5 on a pipe-shaped flow path 7a along the upper end opening of the cup 5. A rinsing liquid feed mechanism for feeding the rinsing liquid such as isopropyl alcohol is connected to be operated on-off on the flow path 7a by a piping. A wafer 3 is placed on a spin head 1, sucked and held thereon, and the rinsing liquid 7c is jetted out of a cup rinsing mechanism 7. A spin head 1 is rotated by one round at the timing of sufficiently wetting an essential site of the cup 5 (a section whereon an excessive coating fluid is scattered from the wafer 3) to drop the coating fluid from a nozzle 4 and apply the same for coating.
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