发明名称 ABRASIVE-BONDED WIRE AND WORKPIECE WORKING DEVICE USING THIS WIRE
摘要 PROBLEM TO BE SOLVED: To make the diameter of a wire saw small and reduce the serf loss by providing a core/sheath structure comprising a core component consisting of an organic fiber with a specific tensile strength and a specific crystal orientation parameter and resin, and a sheath component consisting of resin and abrasive, and thereby improving the working rate and the working precision to maintain the working accuracy constant. SOLUTION: An organic resin layer not containing abrasive covers the surface of an organic fiber of at least 5 GPa tensile strength and 0.05 or less crystal orientation parameter to form a core component, and a sheath component is formed by firmly sticking the abrasive with the resin of the core component or other kind of resin as an adhesive. A wire 1 is stretched at a constant tension by each motor M and is taken up by one reel bobbin 9 from the other reel bobbin 8 through dancer rolls 6, 7 and working rollers 2, 3, 4 for the wire 1 to be wound around plural times, at a specified interval. A work W is raised/lowered to come into contact with the wire 1 traveling between the rollers 2, 3 and then it cut into plural pieces of wafers with a specific thickness. Thus it is possible to make the diameter of the wire saw fine and reduce the serf loss with the improvement of the working accuracy and efficiency, keeping the accuracy.
申请公布号 JP2000176931(A) 申请公布日期 2000.06.27
申请号 JP19980355807 申请日期 1998.12.15
申请人 TOYOBO CO LTD;NIPPEI TOYAMA CORP 发明人 OKUYAMA YUKINARI;NOMURA YUKIHIRO;FUKUDA KOJI;OKUYAMA TETSUO
分类号 B24B27/06;B28D5/04;C08K3/00;C08L79/04;C08L81/00;C08L101/00;(IPC1-7):B28D5/04 主分类号 B24B27/06
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