发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a laser beam machining device that a positioning mark is surely exposed and made easily recognizable in the case of picture processing or the like. SOLUTION: The laser beam machining device is equipped with a laser generator 1 and a converging optical system 3 by which the laser beam 2 from the generator 1 is guided and emitted to a workpiece W, the work piece W is provided with a structure in which the surface of a positioning mark WM and its proximity is covered a first layer W1 of an insulating material, and the first layer W1 is preliminarily irradiated with the laser beam 2 by the converging optical system 3, so that the part covering the surface of the positioning mark WM and its proximity in the first layer W1 is removed.</p>
申请公布号 JP2000176666(A) 申请公布日期 2000.06.27
申请号 JP19980357126 申请日期 1998.12.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORI TOSHIHIRO
分类号 B23K26/00;B23K26/02;B23K26/04;B23K101/42;G01B11/00;H05K1/02;H05K3/00;H05K3/46;(IPC1-7):B23K26/02 主分类号 B23K26/00
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