| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin molding material having low shrinkage without losing various original properties of phenol resin. SOLUTION: This phenolic resin molding material is produced by compounding a phenolic resin with a foaming agent foaming at a temp. of 150-250 deg.C and comprising an organic foaming agent such as N,N'- dinitrosopentamethylenetetramine and azodicarbonamide or an inorganic foaming agent such as sodium bicarbonate.
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