SOLDER MATERIAL EXCELLENT IN JOINTING OF DIAMOND-BASED PR cBM-BASED HIGH-PRESSURE SINTERED BODY TO SUBSTRATE HARD METAL

摘要

PROBLEM TO BE SOLVED: To obtain a solder material excellent in jointing of a diamond-based or cBN-based high-pressure sintered body to a substrate hard metal, which is used for directly brazing these materials to a cutting edge piece brazing part of a cutting tool body. SOLUTION: This solder material is used when a cutting edge piece made of a diamond-based or cBN-based high-pressure sintered body is directly brazed to the cutting edge piece brazing part of a cutting tool constituted of tungsten carbide-based hard metal containing tungsten carbide as main component, and has a composition comprising 20-40 wt. % Cu, 0.5-10 wt.% Ti and the balance Au with inevitable impurities.