发明名称 SHEET FOR FIXING SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To improve water resistance of an antistatic layer suppressing a leakage of the surfactant to maintain the antistatic effect as well as to control deterioration of an expanding property by setting a heat curing antistatic layer with a specified three-dimensional network structure between a base sheet and an adhesive layer or on the other surface of the base without the adhesive layer. SOLUTION: Antistatic layer 1 with a three-dimensional network structure is set on one surface of base sheet 2 by stratifying 0.1-20 g/m2 of a heat curing antistatic agent which is a combination of 100 pts.wt. of a base polymer composed of an acrylic resin or a rubber resin, 10-200 pts.wt. of a functional heat curing compound with two or more functional groups in a molecule, 0.55-25 pts.wt. of a nonionic, anionic, cationic or amphoteric surfactant, and 0.1-10 pts.wt. of a polymerization initiator. Adhesive layer 3 is set on an air containing surface of this antistatic layer 1 on which the peeling paper S is stuck.
申请公布号 JP2000178516(A) 申请公布日期 2000.06.27
申请号 JP19980361736 申请日期 1998.12.21
申请人 TOYO CHEM CO LTD 发明人 SAIDA SEIJI;UCHIDA HIROYUKI;TAKATSU TOMOMICHI;WADA SHIGERU;HAYASHI TAKASHI
分类号 C09J7/02;C09J121/00;C09J133/00;(IPC1-7):C09J7/02 主分类号 C09J7/02
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