发明名称 |
TREATMENT OF SUBSTRATE WITH LIQUID |
摘要 |
PROBLEM TO BE SOLVED: To accurately control the temp. of the treatment soln. supplied to a substrate and to treat the substrate with a small amt. of the treatment soln. efficiently and certainly by heating the substrate to temp. almost same to that of the treatment soln. prior to a liquid treatment process in a wet process executed by supplying the treatment soln. to the substrate. SOLUTION: A substrate feed in/out part 2, a substrate heating part 3 and a liquid treatment part 4 are provided to a liquid treatment station 1 and a robot 5 for feeding a substrate is also arranged thereto. When the substrate 10 is fed to the substrate feed in/out part 2 by an appropriate feed means, the substrate 10 is taken in the liquid treatment station 1 from the substrate feed in/out part 2 by the robot 5 and arranged on the plate heater 6 provided to the substrate heating part 3 at first to be heated to temp. almost same as that of the treatment soln. supplied to the liquid treatment device 7 provided to the liquid treatment part 4 and the heated substrate 10 is transferred to the liquid treatment device 7 and the treatment soln. is supplied during the rotation of the substrate 10 to perform predetermined liquid treatment.
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申请公布号 |
JP2000176359(A) |
申请公布日期 |
2000.06.27 |
申请号 |
JP19980358784 |
申请日期 |
1998.12.17 |
申请人 |
HITACHI ELECTRONICS ENG CO LTD |
发明人 |
FUKUDA HIROSHI;OKADA HIROSHI;SHIMOTORI SEIICHI;SAKAMOTO MANABU |
分类号 |
B05D1/40;B05D3/02;(IPC1-7):B05D1/40 |
主分类号 |
B05D1/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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