发明名称 TREATMENT OF SUBSTRATE WITH LIQUID
摘要 PROBLEM TO BE SOLVED: To accurately control the temp. of the treatment soln. supplied to a substrate and to treat the substrate with a small amt. of the treatment soln. efficiently and certainly by heating the substrate to temp. almost same to that of the treatment soln. prior to a liquid treatment process in a wet process executed by supplying the treatment soln. to the substrate. SOLUTION: A substrate feed in/out part 2, a substrate heating part 3 and a liquid treatment part 4 are provided to a liquid treatment station 1 and a robot 5 for feeding a substrate is also arranged thereto. When the substrate 10 is fed to the substrate feed in/out part 2 by an appropriate feed means, the substrate 10 is taken in the liquid treatment station 1 from the substrate feed in/out part 2 by the robot 5 and arranged on the plate heater 6 provided to the substrate heating part 3 at first to be heated to temp. almost same as that of the treatment soln. supplied to the liquid treatment device 7 provided to the liquid treatment part 4 and the heated substrate 10 is transferred to the liquid treatment device 7 and the treatment soln. is supplied during the rotation of the substrate 10 to perform predetermined liquid treatment.
申请公布号 JP2000176359(A) 申请公布日期 2000.06.27
申请号 JP19980358784 申请日期 1998.12.17
申请人 HITACHI ELECTRONICS ENG CO LTD 发明人 FUKUDA HIROSHI;OKADA HIROSHI;SHIMOTORI SEIICHI;SAKAMOTO MANABU
分类号 B05D1/40;B05D3/02;(IPC1-7):B05D1/40 主分类号 B05D1/40
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